PDC-001-HP (115V) | PDC-002-HP (230V)
PDC-001-HP (115V) | PDC-002-HP (230V)
HIGH POWER EXPANDED PLASMA CLEANER |
| With twice the cleaning rate as the Expanded Plasma Cleaner, the High Power Expanded Plasma Cleaner is a versatile instrument, suitable for etching organic thin films (10-100 nm) as well as surface cleaning and modification. |
FEATURES |
| Larger, benchtop unitAdjustable RF power settings (Low, Medium, High) Maximum RF power of 45WLow RF power setting is equivalent to High RF power setting on PDC-001/PDC-002Includes a 6″ diameter x 6.5″ length Pyrex chamberHinged door with viewing windowActive fan coolingIntegral switch for a vacuum pump1/8″ NPT metering valve to qualitatively control gas flow and vacuum pressure1/8″ NPT 3-way valve to quickly switch from bleeding in gas, isolating the chamber, and ventingWeight: 37 lbsSize: 11″ H x 18″ W x 9″ DOptional PlasmaFlo gas mixer allows quantitative control of up to two (2) process gases and monitoring of chamber pressureOptional quartz chamber and sample trayCompatible vacuum pump available |
REQUIREMENTS |
| Our Plasma Cleaners require a vacuum pump with a minimum pump speed of 1.4 m3/hr (23 L/min) and ultimate total pressure of 200 mTorr (0.27 mbar) or lessFor pumping nonreactive gases (air, N2, Ar), see our Standard Vacuum Pumps.For pumping concentrated or pure oxygen gas, see our Oxygen Service Pumps. |
